US 2003/0113950 A1 · MONOLITHICALLY INTEGRATED COLD POINT THERMOELECTRIC COOLER

Abstract

A method and system for forming a thermoelement for a thermoelectric cooler is provided. In one embodiment a substrate having a plurality of pointed tips covered by a metallic layer is formed. Portions of the metallic layer are covered by an insulator and other portions of the metallic layer are exposed. Next, a patterned layer of thermoelectric material is formed by depositions extending from the exposed portions of the metallic layer in the presence of a deposition mask. Finally, a metallic layer is formed to selectively contact the patterned layer of thermoelectric material.

Claims22

Dependent claims

A method for forming a thermoelement for a thermoelectric cooler, the method comprising:

forming a substrate having a plurality of pointed tips covered by a metallic layer, portions of the metallic layer being covered by an insulator and other portions of the metallic layer being exposed;
forming a patterned layer of thermoelectric material by depositions extending from the exposed portions of the metallic layer in the presence of a deposition mask;
and
forming a metallic layer to selectively contact the patterned layer of thermoelectric material.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

10/015,239Filed 13 Dec 2001

Published

19 Jun 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

H05B 3/22
Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater: non-flexible
H10N 10/01
Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects: manufacture or treatment
H10N 10/13
Operating with only the Peltier or Seebeck effects: characterised by the heat-exchanging means at the junction
H10N 10/82
Constructional details: interconnections

Monolithically integrated cold point thermoelectric cooler

Life of this patent

Monolithically integrated cold point thermoelectric cooler

Life of this patent

Abstract

Claims22