Electrical/optical integration scheme using direct copper bonding

A method of fabricating an intermediate wafer, the method comprising:

• disposing a waveguide within the intermediate wafer;
• positioning an optical coupler adjacent to the waveguide within the intermediate wafer, the coupler enabling transport of an optical signal and one or more intermediate contact pads of the intermediate wafer enabling transport of an electrical signal;
• and
• positioning an electro-optic converter between the optical coupler and the intermediate contact pads, the converter enabling conversion between the optical signal and the electrical signal.

A method of fabricating an electro-optic semiconductor package, the method comprising:

• providing a processor wafer having one or more IC contact pads, the IC contact pads being connected to a computer processor on the processor wafer;
• coupling a release layer to a surface of an intermediate wafer;
• coupling a handle to the release layer;
• disposing a waveguide within the intermediate wafer;
• positioning an optical coupler adjacent to the waveguide within the intermediate wafer, the coupler enabling receipt of an optical signal from the waveguide;
• positioning optical detector between the optical coupler and one or more intermediate contact pads, the optical detector enabling transfer of an electrical signal to the intermediate contact pads based on the optical signal;
• cleaning the contact pads in an acid bath;
• disposing the IC contact pads adjacent to the intermediate contact pads in an oxidation-resistant environment having a predetermined ambient temperature;
• and
• forcing the IC contact pads into direct contact with the intermediate contact pads at a predetermined pressure, a direct copper bond resulting.

An electro-optic semiconductor package comprising:

• an integrated circuit (IC) wafer having one or more IC contact pads, the IC contact pads being connected to an IC on the IC wafer;
• an intermediate wafer having one or more intermediate contact pads, the intermediate contact pads being connected to an electro-optic arrangement on the intermediate wafer;
• and
• said contact pads forming a plurality of direct copper bonds.