Sulfonyloxime compound, and radiation sensitive acid generator, positive type radiation sensitive resin composition and negative type radiation sensitive resin composition using same

A sulfonyloxime compound represented by a general formula (1) shown below,

• 29
• wherein, R1 represents a hydrogen atom, or a substituted or unsubstituted alkyl group of 1 to 20 carbon atoms, substituted or unsubstituted aryl group, or substituted or unsubstituted heteroaryl group, R2 represents a substituted or unsubstituted alkyl group of 1 to 20 carbon atoms, substituted or unsubstituted aryl group, or substituted or unsubstituted heteroaryl group, X represents a halogen atom, Y represents —R3, a —CO—R3 group, —COO—R3 group, —CONR3R4 group, —S—R3 group, —SO—R3 group, —SO2—R3 group, a —CN group or a —NO2 group, and R3 and R4 within said Y group each represent, independently, a hydrogen atom, or a substituted or unsubstituted alkyl group of 1 to 20 carbon atoms, substituted or unsubstituted aryl group, or substituted or unsubstituted heteroaryl group, and including cases in which any two of R1, R2 and R3 are bonded together to form a cyclic structure having formula (2-1), formula (2-2) or formula (2-3) below,
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• wherein, Y″ represents a single bond or a bivalent group formed when said R3 group is removed from said Y group, and dimers represented by formula (3-1), formula (3-2) or formula (3-3) shown below, in which one of said groups R1, R2 or Y functions as a linkage group R1′, R2′ or Y′ respectively
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• wherein, R1′, R2′ and Y′ each represent a bivalent group formed by bonding together residues generated by dissociating one atom or group from two separate R1, R2 or Y groups belonging to separate molecules.