Photosensitive ploysilazane composition, method of forming pattern therefrom, and method of burning coating film thereof
AssigneeClariant Finance (BVI) Limited
InventorsTatsuro Nagahara, Hideki Matsuo
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AssigneeClariant Finance (BVI) Limited
InventorsTatsuro Nagahara, Hideki Matsuo
Estimating the term…
A finely patterned silica type ceramic film suitable as an inter-layer dielectric is formed in a short time by applying, onto a substrate, a positive working radiation sensitive polysilazane composition comprising a modified poly(sil sesquiazane) having a number average molecular weight of 100 to 100,000 and containing a basic constituent unit represented by the general formula: —[SiR6(NR7)1.5]— and other constituent units represented by the general formula: —[SiR62NR7]— and/or —[SiR63(NR7)0.5]— (R6 and R7 independently represent a hydrogen atom, a C1-3 alkyl group or a substituted or unsubstituted phenyl group) in a ratio of 0.1 to 100 mol-% to said basic constituent unit, a photo acid generator and preferably a water-soluble compound as a shape stabilizer, then patternwise exposing the resultant coating film, subjecting the exposed part of the coating film to moistening treatment, developing it with an aqueous alkali solution, wholly exposing the coating film to light and moistening treatment again, followed by burning treatment.
A method of forming a patterned polysilazane film by exposing and then developing a coating film of a radiation sensitive polysilazane composition, wherein the exposed radiation sensitive polysilazane coating film is subjected to moistening treatment and then developed.
A method of burning a radiation sensitive polysilazane coating film, wherein the steps of exposing with light and moistening the radiation sensitive polysilazane coating film are provided as pretreatment steps for burning.
A radiation sensitive polysilazane composition comprising a modified poly(sil sesquiazane) having a number average molecular weight of 100 to 100,000 and containing a basic constituent unit represented by the general formula:
A method of forming a patterned inter-layer dielectric, which comprises forming a coating film of a radiation sensitive polysilazane composition comprising a modified poly(sil sesquiazane) having a number average molecular weight of 100 to 100,000 and containing a basic constituent unit represented by the general formula:
Dependencies are inferred from the claim text.