Silanated copper foils, method of making, and use thereof
OwnerVincent R. Landi, Ki-Soo Kim +1inventors
InventorsVincent R. Landi, Ki-Soo Kim, John T. Neill
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Abstract
A coated foil comprises a thick silane layer disposed on the copper foil, wherein the silane layer is present in an amount greater than or equal to about 0.1 gram per square meter. The copper foil may further comprise thermal barrier. The silanated copper foil may further comprise an elastomer layer disposed on a side of the thick silane layer opposite the copper foil. When the silanated copper foil is used in the manufacture of circuit materials the circuit materials demonstrate improved bond retention after exposure to acidic processing conditions.
Claims24
A coated foil comprising a thick silane layer disposed on the copper foil, wherein the silane layer is present in an amount greater than or equal to about 0.1 gram per square meter.
A circuit material, comprising
- a silane layer disposed between a copper foil and a first side of a circuit substrate, wherein the silane layer is present in an amount greater than or equal to about 0.1 grams per square meter.
A circuit comprising:
- a copper foil;
- a silane layer, wherein the silane layer is present in an amount greater than or equal to about 0.1 grams per square meter;
- a circuit substrate having a first and second side;
- and
- a patterned circuit layer, wherein the copper foil is disposed on the first side of the circuit substrate material, the patterned circuit layer is disposed on the second side of the circuit substrate material, and the first silane layer is disposed between at least one of the copper foil and the first side of the circuit substrate material or between the patterned circuit layer and the second side of the circuit substrate material.
A method of making a coated foil comprising:
- coating a copper foil with a silane;
- and
- curing the silane to provide a silane coating in an amount greater than or equal to about 0.1 g/m2.
Dependencies are inferred from the claim text.