Multi-layers with vias in filled holes
OwnerMark S. Lopac, David R. Backen +2inventors
InventorsMark S. Lopac, David R. Backen, Kevin C. Dane, Steve H. Schultz
Life of this patent
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Abstract
Multi-layers having at least one plated and filled via or through hole in which a portion of the material filling the via or through hole is removed to allow the spaced previously occupied by the removed material to be used for some other purpose. In some multi-layers, the removed material will be replaced by a second plated via or through hole thus providing additional interconnect options or to functioning as a part of a larger component.
Claims9
A multi-layer substrate comprising a first plated and filled via or through hole wherein at least one component is located at least partially within the filled portion of the plated and filled via or through hole.
A method of forming a multi-layer substrate comprising:
- providing a multi-layer substrate comprising a first plated through hole, the plated through hole comprising a filled center;
- adding additional layers to the multi-layer substrate;
- removing a portion of the additional layers and a portion of the filled center of the plated through hole;
- forming a component that extends at least partially into the removed portion of the filled center of the plated through hole.
Dependencies are inferred from the claim text.