Loading patent…
AssigneeKonica Corporation
InventorsKazuhiro Fukuda, Yoshikazu Kondo, Yoshiro Toda, Kiyoshi Oishi, Akira Nishiwaki, Wataru Mizuno
Estimating the term…
An atmospheric pressure plasma treatment apparatus is disclosed which comprises a first electrode and a second electrode opposed to each other, a discharge space between the opposed electrodes, a voltage application means for applying voltage across the discharge space, a gas supply means for supplying a reactive gas and an inert gas to the discharge space, wherein the reactive gas at the discharge space is excited at atmospheric pressure or at approximately atmospheric pressure by applying voltage through the voltage application means to generate discharge plasma, and a substrate is exposed to the discharge plasma to be subjected to surface treatment, and wherein the reactive gas is not directly in contact with the discharge surface of the first electrode or the second electrode.
An atmospheric pressure plasma treatment apparatus comprising a first electrode and a second electrode opposed to each other in which a discharge space is formed between the opposed electrodes, a voltage application device for applying voltage across the discharge space, a gas supply device for supplying a reactive gas and an inert gas to the discharge space, wherein the reactive gas at the discharge space is excited at atmospheric pressure or at approximately atmospheric pressure by applying voltage through the voltage application device to generate discharge plasma, and a substrate is exposed to the discharge plasma to be subjected to surface treatment, and wherein the reactive gas is not directly in contact with the discharge surface of the first electrode or the second electrode.
An atmospheric pressure plasma treatment method comprising the steps of:
Dependencies are inferred from the claim text.