System and method of producing wafer
AssigneeHitachi High-Technologies Corporation
InventorsTetsunori Kaji, Yoichi Uchimaki, Yuko Egawa
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AssigneeHitachi High-Technologies Corporation
InventorsTetsunori Kaji, Yoichi Uchimaki, Yuko Egawa
Estimating the term…
A system and method of manufacturing wafers are provided suitable for a semiconductor manufacturing system and a method thereof capable of shortening the processing period composed of a series of processes applied to objects to be processed, mainly carry out processes and conveyance peace by peace, and which can manufacture even various kings of products. The system is provided with a plurality of processing units each having therein a conveying mechanism, and is provided therein with a conveyer device for conveying the objects to be processed to the processing units. Further, the conveyer device includes loader conveying means which is laid along object transferring ports of the plurality of processing units across the object transferring ports of not less than two of the processing units, and a running robot which runs across not less than two of the object transferring ports, and a transferring robot for transferring the objects to be processed from the running robot to the processing units through the transferring ports, are arranged in the loader means. The loader means is shielded and provided with a purifying device so as to define an atmospheric pressure space conveying path.
A wafer manufacturing system, the system providing with a conveyer device for conveying objects to be processed to a plurality of processing units which are arranged in a line, and each of which includes therein a conveying mechanism, through an atmospheric pressure space that is shielded from the atmospheric air, and provided therein with a purifying device, wherein
A wafer manufacturing system, the system comprising a plurality of processing units arranged in a line and each having therein a conveying mechanism, and a conveyer device for conveying objects to be processed to the processing units, wherein:
A wafer manufacturing method with the use of a wafer manufacturing apparatus comprising a plurality of processing units each having therein a conveying mechanism, and a conveyer device for conveying objects to be processed to the processing units in an atmospheric pressure space which is arranged in the atmospheric air, being shielded therefrom and which is provided therein with a purifying device, comprising the steps of:
Dependencies are inferred from the claim text.