Method of packaging a photonic component and package

A VOA package, the VOA package enclosing a semiconductor die, the semiconductor die comprising or coupled with a movable mirror, and the semiconductor die having a first side with at least two electrical contact pads and a second opposite side comprising or coupled with the movable mirror, and the package coupled with a collimator, the collimator positioning at least two optical fibers, the package comprising:

• a package body, a lid, and at least two leads;
• the package body, or body, having a photonic inlet side, a cavity side, a through hole and a cavity;
• the through hole extending from the photonic inlet side and to the cavity, and the through hole for enabling light to pass to and from the movable mirror and the at least two optical fibers;
• the lid coupled with the body and enclosing the cavity;
• and
• whereby the semiconductor die is attached to the body and within cavity, and the mirror of the semiconductor die is positioned to variably optically attenuate an optical signal emitted from one of the at least two optical fibers through a collimator lens by controllably redirecting the optical signal reflected from the mirror and going back through the collimator lens to another optical fiber.

A method to package a photonic component, comprising:

• providing a semiconductor die, the semiconductor die having a photonic element, a first side with at least two electrical contact pads and a second opposite side coupled with the photonic element;
• providing a package, the package comprising a package body, a lid, and at least two leads;
• the package body, or body, having a photonic inlet side, a cavity side, a through hole and a cavity, and the through hole extending from the photonic inlet side and to the cavity, and the through hole for enabling light to pass to and from the cavity;
• die attaching the semiconductor die to the package body and at least partially within cavity, and in an orientation that enables light to pass from the photonic element and out of the package via the through hole;
• and
• coupling the lid with the package body and enclosing the cavity, whereby the semiconductor die is attached to the package body and within the cavity, and each of the at least two leads is electrically coupled with at least one of the at least two electrical contact pads of the semiconductor die, and an area of the second opposite side is positioned to transmit or receive light via the through hole.