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US 2003/0112710 A1Published application
Reducing thermal drift in electronic components
OwnerJohn C. Eidson, Stanley P. Woods +1inventors
InventorsJohn C. Eidson, Stanley P. Woods, Hans Sitte
Life of this patent
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Abstract
A variety of techniques for low cost reduction of thermal drift in electronic components. These techniques include structures for increasing the thermal mass of an electronic component and for insulating an electronic component from thermal drift caused by air flow as well as structures for thermally isolating an electronic component from heat flow on a circuit board.
Claims20
A circuit, comprising:
- electronic component;
- structure for reducing thermal drift in the electronic component.
A distributed system having a set of nodes, each node comprising:
- local clock including a crystal component;
- structure for reducing thermal drift in the electronic component.
Dependencies are inferred from the claim text.