Semiconductor memory device
AssigneeKabushiki Kaisha Toshiba
InventorsHideo Mukai, Kaoru Nakagawa
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AssigneeKabushiki Kaisha Toshiba
InventorsHideo Mukai, Kaoru Nakagawa
Estimating the term…
In a DRAM semiconductor memory device, a DRAM semiconductor memory device disclosed herein comprises a first spare element SWL provided for each of a plurality of normal banks BANK0-BANK15 formed by dividing a memory cell array into a plurality of sections, a second spare element SWL provided for a spare bank BANKSP different from the normal banks, a plurality of first spare decoders SRD0-SRD3 for selectively operating the first spare element, a plurality of second spare decoders SRD0-SRD3 for selectively operating the second spare element, and a substitution-control circuits FS0a-FS27a, RWLON1-RWLON2, SRDact0-SRDact3 for selectively assigning the second spare elements to arbitrary banks of the plurality of normal banks. With the above structure, the total number of the spare elements of the defective memory cells of the DRAM can be reduced while the relieving ratio is being maintained. As a result, the area efficiency of the redundant circuit on the chip can be improved.
A semiconductor memory device comprising:
A semiconductor memory device comprising:
A semiconductor memory device comprising:
A semiconductor memory device comprising:
A semiconductor memory device comprising:
A semiconductor memory device comprising:
Dependencies are inferred from the claim text.