US 2003/0112612 A1 · Combination device of the IC connection device and the main board

Abstract

A combination device of the IC package connection device and the main board comprises a socket and a main board. The socket has a holding assembly which is placed on the top surface of the socket. The holding assembly connects to the external IC package electrically and the socket has a plurality of solder balls. The solder balls are placed on the bottom surface of the socket and connect to the holding assembly electrically. The socket is stable on the top surface of the main board and connects to the main board electrically. The positions of a plurality of PTHs in the main board are corresponding to the plurality of solder balls. The totally melting temperature of the solder balls is higher than that in prior art in order to make the solder balls be in controllable semi-solid state in solder reflow step. And a part of the solder ball will flow into a part of the PTH in order to form the mushroom-shape structure having an upper-mushroom part on the top surface of the main board and a lower-mushroom part flowing into the part of the PTH.

Claims21

Dependent claims

A combination device of an IC package connection device and a main board comprises:

a socket comprises:
a holding assembly being placed on the top surface of the socket and connecting an external IC package device;
and
a plurality of the first solder balls being placed on the bottom surface of the socket and connecting to the holding assembly electrically;
and,
a main board on the top surface of which combining the socket and connecting the socket electrically, the main board comprises:
a plurality of PTHs which positions being corresponding to the plurality of the first solder balls which flowing into a part of the PTH to make the first solder balls form the mushroom-shape structure with upper-mushroom part and lower-mushroom part flowing into a part of the PTH.

4 more elements

A combination of an IC package connection device and a main board comprises:

a pin-style socket comprises:
a first holding assembly being on the top surface of the pin-style socket and being used to connect an external IC package electrically, and
a plurality of pins being combined on the bottom surface of the pin-style socket and connecting to the first holding assembly electrically;
a ball-style socket comprises:
a second holding assembly being on the top surface of the ball-style socket and being used to connect an external IC package electrically, and
a plurality of the first solder balls being combined on the bottom surface of the ball-style socket and connecting to the second holding assembly electrically;
and
a main board which comprises a plurality of PTHs;
wherein the corresponding positions of the plurality of PTHs and the plurality of the first solder balls and the plurality of pins are the same, the combination device of the IC package connection device and the main board is formed by combining the main board and one of the pin-style socket and the ball-style socket in order to make the main board be suitable for both sockets:
and
when the main board and pin-style socket being combined, each pin in the pin-style socket is plugging in the corresponding PTH of the main board;
when the main board and ball-style socket being combined, a part of each first solder ball will flow into a part of the PTH in order to make the first solder ball form a mushroom-shape structure having an upper-mushroom part on the top surface of the main board and a lower-mushroom part flowing into the part of the PTH.

9 more elements

Dependencies are inferred from the claim text.

Combination device of the IC connection device and the main board

Life of this patent

Combination device of the IC connection device and the main board

Life of this patent

Abstract

Claims21