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US 2003/0112605 A1Published application
Power module and process for producing power modules
OwnerWolfram Hableinventor
Life of this patent
Estimating the term…
Abstract
A power module has a circuit carrier that, on its upper side is coated with a structured metal layer and mounted with power components. The power components are driven by flat conductors, the inner flat-conductor ends of which interact, via thermocompression heads, with contact-connection surfaces, while the outer flat-conductor ends project out of the housing of the power module. A process is described for producing the power module.
Claims49
A power module, comprising:
- an insulation plate coated with metal on both sides, functioning as a circuit carrier, having an upper side with a structured metal layer, and having power components mounted on said structured metal layer, said structured metal layer having a contact-connection surface;
- a housing encasing said insulation plate;
- a flat conductor having an inner flat-conductor end and an outer flat conductor end projecting outside of said housing;
- and
- a thermocompression head electrically interconnecting said flat-conductor end and said contact-connection surface of said structured metal layer.
2 more elements
A process for producing a power module, which comprises the steps:
- providing a circuit carrier board having contact islands, conductor tracks, and contact-connection surfaces of a structured metal layer in a plurality of module installation positions;
- coating at least the contact-connection surfaces with a bondable coating;
- applying thermocompression heads to the contact-connection surfaces;
- dividing the circuit carrier board into individual circuit carriers for each module installation position;
- providing a system carrier having a system carrier frame;
- extending flat conductors with inner flat-conductor ends from the system carrier frame toward a plurality of the module installation positions;
- orienting and connecting the thermocompression heads on the contact-connection surfaces of each circuit carrier to the inner flat-conductor ends of each leadframe in the module installation positions of the system carrier;
- applying a plurality of power components in each module installation position;
- applying bonding connections to the power components;
- packaging each module installation position of the system carrier together with power components disposed on the circuit carriers in a housing;
- and
- dividing the system carrier into individual multichip power modules.
9 more elements
A process for producing a power module, which comprises the following process steps:
- providing a circuit carrier board having a plurality of module installation positions including contact islands, conductor tracks, and contact-connection surfaces of a structured metal layer;
- selectively coating the contact-connection surfaces with a bondable coating;
- mounting a plurality of power components on the circuit carrier board in each module installation position;
- applying bonding connections in each module installation position;
- applying thermocompression heads to the contact-connection surfaces;
- dividing the circuit carrier board into individual circuit carriers for each module installation position;
- providing a system carrier having a system carrier frame;
- extending flat conductors with inner flat-conductor ends toward a plurality of the module installation positions;
- orienting and connecting the thermocompression heads on the contact-connection surfaces of each circuit carrier to the inner flat-conductor ends of each leadframe in the module installation positions of the system carrier;
- packaging each module installation position of the system carrier together with power components disposed on circuit carriers in a housing;
- and
- dividing the system carrier into individual multichip power modules.
9 more elements
Dependencies are inferred from the claim text.