Multi-chip package with embedded cooling element
AssigneeVia Technolgies, Inc.
InventorChi-Hsing Hsu
Life of this patent
Estimating the term…
Abstract
A multi-chip package having one or more embedded cooling elements. The package includes a substrate, a plurality of chips, at least one cooling element, a plurality of solder balls and packaging material. The substrate has a front surface and a corresponding back surface. The chip is attached to the front surface of the substrate and electrically connected to the substrate. At least one cooling element is attached to the chips through thermal glue. The solder balls are attached to the back surface of the substrate. The packaging material encloses the substrate, the chips and the cooling elements.
Claims18
A multi-chip package having at least one embedded cooling element, comprising:
- a substrate having a front surface and a corresponding back surface;
- a plurality of chips on the front surface of the substrate and electrically connected to the substrate;
- at least one cooling element attached to one of the chips, wherein the cooling element is attached to the chip through thermal glue;
- a plurality of solder balls attached to the back surface of the substrate;
- and
- packaging material for enclosing the substrate, the chips and the cooling element.
A multi-chip package having at least one embedded cooling element, comprising:
- a lead frame having a die pad and a plurality of leads, wherein the leads are positioned around the die pad, and each lead can be divided into an inner lead section and an outer lead section;
- a plurality of chips on die pad surface, wherein the chips and the leads are electrically connected by conductive wires;
- at least one cooling element attached to at least one of the chips, wherein the cooling element is attached to the chip through thermal glue;
- and
- packaging material for enclosing the die pad, the chips, the inner lead sections of the leads and the cooling elements while exposing the outer lead sections of the leads.
A multi-chip package having at least one embedded cooling element, comprising:
- a substrate having a front surface and a back surface;
- a plurality of packages on the front surface of the substrate with each package having at least a chip enclosed by a packaging material, wherein at least one package contains a cooling element attached to the chip through thermal glue;
- and
- a plurality of solder balls attached to the back surface of the substrate.
Dependencies are inferred from the claim text.