Method for producing a tag or a chip card, device for implementing said method and tag or chip card produced according to said method
AssigneeInterlock Corporation
InventorWerner Vogt
Life of this patent
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AssigneeInterlock Corporation
InventorWerner Vogt
Estimating the term…
A method for manufacturing a tag encompassing an antenna or coil that is capable of at least one of wirelessly transmitting information to remote receivers and receiving information from remote transmitters. The method includes die-cutting a coil or antenna shape from an electrically conductive flat double foil having an upper electrically conductive flat foil layer of a soft, inelastic metal and a lower synthetic film substrate layer, the die-cutting including cutting with a die-cutting tool having a single die-cutting blade which matches the desired antenna or coil shape, the blade completely perforating the upper electrically conductive flat foil and at least partially separating the lower synthetic film substrate so that a gap the distance created in the flat foil by die-cutting remains after the die-cutting tool is removed. Subsequently the cut shape is bonded with additional layers including an electronic chip module.
Method for manufacturing a tag encompassing an antenna or coil that is capable of wirelessly transmitting information to remote receivers and/or receiving information from remote transmitters, a chip or identification card or a transponder unit or the like, wherein the coil or antenna shape is produced by stamping it from an electrically conductive flat foil and it is then bonded with additional layers including an electronic chip module.
A tag containing an antenna or coil, a chip or identity card, a transponder unit and the like, wherein one of the layers (20, 21, 22, 16) forming the tag or the chip card is produced from a double foil, consisting of an electrically conductive flat material and a synthetic substrate, whereby the antenna or coil is stamped into said foil in the form of concentric, electrically isolated turns, the beginning and end section of which is connected to a chip module.
Dependencies are inferred from the claim text.