Embedded inductor and method of making
AssigneeInternational Business Machines Corporation
InventorsDavid Clifford Long, Harsaran S. Bhatia, Harvey Charles Hamel, Edward R. Pillai, Christopher David Setzer, Benjamin Paul Tongue
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Abstract
A dielectric substrate having an embedded inductor wherein each turn of the inductor traverses several layers such that the top and bottom of each turn of the inductor are parallel to each other but are in different layers and the sides of each turn of the inductor traverse at least one layer to connect the top and bottom of the inductor.
Claims20
A dielectric substrate having a multiturn inductor comprising:
- a) a multilayer dielectric body comprising a plurality of layers;
- b) a multiturn inductor buried within the dielectric body, each turn of the inductor comprising a bottom portion, a top portion and two side portions, the bottom portion and top portion being parallel and in different layers of the dielectric body, the side portions being parallel to each other and extending between the top and bottom portions and comprising vias in the dielectric body.
A method of forming a dielectric substrate having a multiturn inductor, the method comprising the steps of:
- a) obtaining a plurality of layers;
- b) forming conductive lines on a first group of layers;
- c) forming conductive vias in a second group of layers;
- d) forming conductive lines on a third group of layers;
- e) stacking at least one layer from the second group of layers on at least one layer from the third group of layers;
- and
- f) stacking at least one layer from the first group of layers on the at least one layer from the second group of layers wherein the stacking of the first, second and third groups of layers form an inductor buried within a dielectric substrate.
Dependencies are inferred from the claim text.