Film bulk acoustic resonator structure and method of making
AssigneeIntel Corporation
InventorsQing Ma, Li-Peng Wang, Valluri Rao
Life of this patent
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AssigneeIntel Corporation
InventorsQing Ma, Li-Peng Wang, Valluri Rao
Estimating the term…
A film bulk acoustic resonator is formed on a substrate having a major surface. The film bulk acoustic resonator includes an elongated stack. The elongated stack includes a layer of piezoelectric material positioned between a first conductive layer deposited on a first surface of the layer of piezoelectric material, and a second conductive layer deposited on a second surface of the layer of piezoelectric material. The elongated stack is positioned substantially perpendicular with respect to the major surface of the substrate. The first and second conductive layers are placed on the layer of piezoelectric material substantially simultaneously and in one processing step. The major surface of the substrate is in a horizontal plane and the stack of the film bulk acoustic resonator is in a substantially vertical plane. The resonator structure formed may be used either as a resonator or a filter.
A film bulk acoustic resonator formed on a substrate having a major surface, the film bulk acoustic resonator comprising:
A filtering device comprising:
A method for forming a device in a substrate comprising:
A method for forming a film bulk resonator comprising:
A method for forming a device in a substrate comprising:
Dependencies are inferred from the claim text.