Resilient and rugged probe
AssigneeChung-Shan Institute of Science and Technology
InventorsJoseph D. S. Deng, Hong-Chyi Lee
Life of this patent
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Abstract
A resilient and rugged probe, used to measure an on-wafer signal. The probe has a metal probe tip, a resilient soft multi-layered dielectric substrate, a planar transmission structure and a fixed end. The probe tip is connected to the planar transmission structure. The planar transmission structure is attached to and supported by the resilient soft multi-layered dielectric substrate and then connected to the fixed end.
Claims23
A resilient and rugged probe, to measure a on-wafer signal, the probe comprising:
- a metal probe tip;
- a resilient soft multi-layered dielectric substrate, coupled to the metal probe tip;
- a planar transmission structure, coupled to the metal probe tip and the resilient soft multi-layered dielectric substrate;
- and
- a fixed end, coupled to the resilient soft multi-layered dielectric substrate and the planar transmission structure.
A resilient and rugged probe, used to measure a signal of a substrate, comprising:
- a probe tip;
- a planar transmission structure, coupled to the probe tip;
- and
- a multi-layered dielectric material, coupled to the planar transmission structure and the probe tip, wherein the multi-layered dielectric material allows a device to be embedded therein.
A resilient and rugged probe, used to measure an on-wafer signal, comprising:
- a probe tip;
- a connector, coupled to the probe tip;
- and
- a multi-layered dielectric material, coupled to the planar transmission structure and the probe tip, wherein the multi-layered dielectric material allows a device to be embedded therein.
Dependencies are inferred from the claim text.