Power/ground ring substrate for integrated circuits
AssigneeTexas Instruments Incorporated
InventorMilton Lee Buschbom
Life of this patent
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Abstract
A substrate (110) for an unpackaged integrated circuit (IC) chip (118). The substrate comprises an insulative material (112), a plurality of contacts (114) disposed thereon, and a conductive ring (150) disposed around the outer perimeter of the contacts (114). Conductive traces (115) may be disposed around one or more contacts (114) and may be coupled to the conductive ring (150). An electro-less plating technique is utilized to plate contacts (114), avoiding unnecessary conductive material such as plating stubs being included in the contact (114) pattern, reducing interference. The conductive ring (150) shields the chip (118) from interference.
Claims28
A substrate for an unpackaged integrated circuit chip having surface mount contacts disposed thereon in a pattern, comprising:
- an insulating material;
- and
- a conductive material disposed over the insulating material, the conductive material comprising a plurality of contacts arranged in a pattern corresponding to the integrated circuit contact pattern, the conductive material comprising a conductive ring disposed around the periphery of the contact pattern, wherein the substrate contacts are coupleable to the integrated circuit chip surface mount contacts.
A package for an integrated circuit chip having surface mount contacts disposed thereon in a pattern, comprising:
- a substrate including an insulating material and a conductive material disposed over the insulating material, the conductive material comprising a plurality of contacts arranged in a pattern corresponding to the integrated circuit contact pattern, the conductive material comprising a conductive ring disposed around the periphery of the contact pattern, wherein the substrate contacts are coupleable to the integrated circuit chip surface mount contacts.
A method of manufacturing a substrate for an unpackaged integrated circuit chip having surface mount contacts disposed thereon in a pattern, comprising:
- providing an insulating material;
- disposing a conductive material over the insulating material;
- patterning the conductive material to form a plurality of contacts arranged in a pattern corresponding to the integrated circuit contact pattern;
- and
- forming a ring in the conductive material around the periphery of the conductive material contacts, wherein the substrate contacts are coupleable to the integrated circuit chip surface mount contacts.
Dependencies are inferred from the claim text.