Semiconductor device and method for producing the same
AssigneeNEC Electronics Corporation
InventorsHiroaki Tomimori, Hidemitsu Aoki, Kaoru Mikagi, Akira Furuya, Tetsuya Tao
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Abstract
An oxide film formed on the surface of copper film of an electrode pad is cleaned by oxalic acid after unevenness is formed on the surface of copper film by treating the surface with organic acid. Thereby, stable resistance is obtained when carrying out a characteristic inspection by bringing a probe into contact with the electrode pad, and it is easily recognized by observation through a microscope that the probe is brought into contact with the electrode pad. In addition, wettability with respect to solder is satisfactory, and it is possible to favorably form a solder bump on the electrode pad.
Claims19
A semiconductor device comprising:
- a wiring layer provided on a semiconductor substrate;
- and
- an electrode pad for inspection provided on said wiring layer which has a laminated structure of a barrier metal layer and a contact layer laminated in this order, said electrode pad having unevenness formed on the surface thereof.
A method for producing a semiconductor device, comprising the steps of:
- forming a wiring layer on a semiconductor substrate;
- forming an electrode pad for inspection on said wiring layer, said electrode pad having unevenness on the surface thereof;
- and
- cleaning the surface of said electrode pad for inspection by a cleaning solution containing carboxylic acid or its salt.
Dependencies are inferred from the claim text.