Mounting material, semiconductor device and method of manufacturing semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsCao Minh Thai, Hiroshi Tateishi, Koichi Teshima, Masahiro Tadauchi, Izuru Komatsu, Tetsuji Hori
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Abstract
The present invention provides a semiconductor device comprising a frame including a die pad and a lead portion, a semiconductor element, a wire including one end connected to the semiconductor element and another end connected to the lead portion, at least one first bonding portion formed of a solder material and bonding a part of the die pad to a part of the semiconductor element, and at least one second bonding portion formed of a thermosetting resin and bonding another part of the die pad to another part of the semiconductor element.
Claims19
A semiconductor device, comprising:
- a frame including a die pad and a lead portion;
- a semiconductor element;
- a wire including one end connected to the semiconductor element and another end connected to the lead portion;
- at least one first bonding portion formed of a solder material and bonding a part of the die pad to a part of the semiconductor element;
- and
- at least one second bonding portion formed of a thermosetting resin and bonding another part of the die pad to another part of the semiconductor element.
A mounting material comprising:
- a solder material body including a hollow portion;
- and
- an adhesive loaded in the hollow portion of the solder material body and containing an uncured thermosetting resin.
A method of manufacturing a semiconductor device, said semiconductor device comprising a semiconductor element and a frame, the frame including a die pad and a lead portion, said method comprising:
- bonding a part of the die pad to a part of the semiconductor element by curing an uncured thermosetting resin;
- soldering another part of the die pad to another part of the semiconductor element;
- and
- applying a wire bonding between the semiconductor element and the lead portion of the frame.
A method of manufacturing a semiconductor device, said semiconductor device comprising a semiconductor element and a frame, the frame including a die pad and a lead portion, said method comprising:
- soldering a part of the die pad to a part of the semiconductor element with a solder material;
- applying an uncured thermosetting resin to surround the solder material;
- curing the uncured thermosetting resin, whereby the thermosetting resin bonds another part of the die pad to another part of the semiconductor element;
- and
- applying a wire bonding between the semiconductor element and the lead portion of the frame.
A method of manufacturing a semiconductor device, said semiconductor device comprising a semiconductor element and a frame, the frame including a die pad and a lead portion, said method comprising:
- loading a mounting material in a clearance between the die pad and the semiconductor element, the mounting material including a composite body of an uncured thermosetting resin and a solder material;
- melting the uncured thermosetting resin and the solder material;
- curing the molten uncured thermosetting resin to bond a part of the die pad to a part of the semiconductor element;
- solidifying the molten solder material to bond another part of the die pad to another part of the semiconductor element;
- and
- applying a wire bonding between the semiconductor element and the lead portion of the frame.
Dependencies are inferred from the claim text.