Semiconductor integrated circuit device and printed wired board for mounting the same
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorHitoshi Kurusu
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Abstract
The object of the present invention is to provide a semiconductor integrated circuit device and a printed wired board, which can self-align to each other in an exact and precise manner. The semiconductor integrated circuit device have a plurality of conductive bumps. The printed wired board have a plurality of conductive recessed members at positions corresponding to those of the conductive bumps. Each of the conductive bumps is fit into the corresponding conductive recessed member so that the printed wired board is aligned to the semiconductor integrated circuit device.
Claims11
A printed wired board for mounting a semiconductor integrated circuit device having a plurality of conductive bumps thereon, comprising:
- a plurality of conductive recessed members at positions corresponding to those of the conductive bumps;
- wherein each of the conductive bumps is fit into the corresponding conductive recessed member so that the printed wired board is aligned to the semiconductor integrated circuit device.
A semiconductor integrated circuit device to be mounted on a printed wired board having a plurality of conductive bumps thereon, comprising:
- a plurality of conductive recessed members at positions corresponding to those of the conductive bumps;
- wherein each of the conductive bumps is fit into the corresponding conductive recessed member so that the semiconductor integrated circuit device is aligned to the printed wired board.
A printed wired board for mounting a semiconductor integrated circuit device of a predetermined planar configuration having a plurality of conductive bumps thereon, comprising:
- a bottom surface and a peripheral wall surface together defining a receiving depression having the predetermined planar configuration substantially identical to that of the semiconductor integrated circuit device;
- and
- a plurality of substrate electrodes formed on the bottom surface;
- wherein the semiconductor integrated circuit device is received into the receiving depression so that each of the conductive bumps is aligned to the corresponding substrate electrode.
Dependencies are inferred from the claim text.