Ball grid array package substrates and method of making the same

An integrated circuit (IC) package, comprising:

• a substrate that has a first surface, wherein said first surface has a central opening;
• a stiffener that has a first surface, wherein said first surface of said stiffener has a central ground ring, wherein said first surface of said stiffener is attached to said substrate;
• wherein said central opening has an edge, wherein said edge includes at least one of:
• (a) a protruding edge portion that extends across at least a portion of said central ground ring,
• (b) a recessed edge portion that exposes a portion of said central ground ring, or
• (c) a hole proximate to said edge, wherein the hole exposes a portion of said central ground ring.

A method of forming a substrate for an integrated circuit (IC) package, comprising the steps of:

• (1) forming a central opening in a substrate, wherein the central opening has an edge;
• and
• (2) forming the edge to include at least one of:
• (a) a protruding edge portion that extends into the central opening,
• (b) a recessed edge portion, or
• (c) a hole through the substrate proximate to the edge.