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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsHideki Takehara, Noriyuki Yoshikawa, Susumu Tsumura
Estimating the term…
One side of a ceramic multilayer board is attached to a resin film with adhesive, the resin film is mounted on a mold for resin sealing having a cavity provided in desired position, the position of the board is controlled by pressing against a portion of the resin film by a portion of the mold for sealing, and thereafter sealing is conducted by filling an epoxy resin into the cavity. The thus prepared semiconductor device has a rear face on which electrodes for connecting to outside are exposed, and the sealing resin is formed so as to be flush with respect to the rear face of the board, surround the periphery of the board, and form a cross section in a rectangular shape. With this configuration, the semiconductor device free from a crack can be sealed with resin.
A semiconductor device of one side molded type, comprising a ceramic multilayer board having a surface and a rear face, on the surface an active component and a passive component being mounted and the surface being sealed with a resin, and on the rear face electrodes for connecting to outside being exposed,
A method for manufacturing a one side molded type semiconductor device that comprises a ceramic multilayer board having a surface and a rear face, on the surface an active component and a passive component being mounted and the surface being sealed with a resin, and on the rear face electrodes for connecting to outside being exposed, comprising the steps of:
Dependencies are inferred from the claim text.