Semiconductor device and method of fabricating the same
AssigneeKabushiki Kaisha Toshiba
InventorMitsuhiro Nakao
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Abstract
There is here disclosed a semiconductor device comprising a chip-mounting-member having a lead formed on its major surface, the lead having a thin film plated portion which covers a surface of a predetermined portion of the lead, a semiconductor chip having a bump formed on its major surface, and mounted on the chip-mounting-member by electrically connecting the bump to the lead via the plated portion, and an encapsulating-member formed between the semiconductor chip and the chip-mounting-member.
Claims20
A semiconductor device comprising:
- a chip-mounting-member having a lead formed on a major surface thereof, said lead having a thin film plated portion which covers a surface of a predetermined portion of said lead;
- a semiconductor chip having a bump formed on a major surface thereof, and mounted on said chip-mounting-member by electrically connecting said bump to said lead via said plated portion;
- and
- an encapsulating-member formed between said semiconductor chip and said chip-mounting-member.
A semiconductor device fabrication method comprising:
- opposing a semiconductor chip having a bump formed on a major surface thereof to a chip-mounting-member having a lead formed on a major surface thereof, said lead having a thin film plated portion which covers a surface of a predetermined portion of said lead;
- forming an encapsulating-member between said semiconductor chip and said chip-mounting-member;
- and
- electrically connecting said bump and said lead via said plated portion, and encapsulating and adhering said semiconductor chip and said chip-mounting-member by using said encapsulating-member, thereby connecting/encapsulating said semiconductor chip and said chip-mounting-member.
A semiconductor device fabrication method comprising:
- opposing a semiconductor chip having a bump formed on a major surface thereof to a chip-mounting-member having a lead and an encapsulating-member formed on a major surface thereof, said lead having a thin film plated portion which covers a surface of a predetermined portion of said lead;
- and
- electrically connecting said bump and said lead via said plated portion, and encapsulating and adhering said semiconductor chip and said chip-mounting-member by using said encapsulating-member, thereby connecting/encapsulating said semiconductor chip and said chip-mounting-member.
Dependencies are inferred from the claim text.