Electronic device and leadframe and methods for producing the electronic device and the leadframe
AssigneeInfineon Technologies AG
InventorsMartin Reiss, Jurgen Zacherl
Life of this patent
Estimating the term…
Abstract
The invention relates to an electronic device and a leadframe and to methods for producing the electronic device and the leadframe. The electronic device has a semiconductor chip with a top side fixed on a rewiring plate by a double-sided adhesive film. The underside of the rewiring plate has an edge region with through openings. The through openings are filled with a plastics compound that holds together the semiconductor chip and the rewiring plate by acting as a mechanical clip.
Claims27
An electronic device, comprising:
- a semiconductor chip having an active top side;
- a rewiring plate having a top side and an underside;
- and
- a double-sided adhesive film connecting said top side of said rewiring plate to said active top side of said semiconductor chip;
- said rewiring plate formed with a plurality of through openings filled with a plastics compound;
- said plastics compound encapsulating said top side of said semiconductor chip at said underside of said rewiring plate;
- and
- said plastics compound forming a mechanical clip for said semiconductor chip and said rewiring plate.
A leadframe for a plurality of electronic devices, the leadframe comprising:
- a top side with a plurality of device positions for positioning a double-sided adhesive film and for fitting a respective semiconductor chip in each one of said plurality of said device positions;
- each one of said plurality of said device positions having edge regions formed with a plurality of through openings for introducing a mechanical clip made of a plastics compound.
A method for producing a leadframe, which comprises:
- providing a core plate made of a glass-fiber-reinforced plastic and providing the core plate with an underside including a structured metal layer having rewiring lines formed with ends having external contact areas for external contacts and bonding ends for bonding connections, the rewiring lines being formed in a plurality of device positions;
- applying an insulation layer on the underside of the core plate without covering the bonding ends and without covering the external contact areas;
- in each one of the plurality of the device positions, introducing a through opening serving as a bonding channel;
- and
- in edge regions of each one of the plurality of the device positions, introducing a plurality of through openings for receiving a mechanical clip made of a plastics compound.
Dependencies are inferred from the claim text.