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US 2003/0111715 A1Published application
Current supply and support system for a thin package
AssigneeIntel Corporation
InventorGlenn E. Stewart
Life of this patent
Estimating the term…
Abstract
An electronic package that includes an interposer, a die and laminated conductor. The die and laminated conductor are secured to the interposer such that the laminated conductor mechanically supports the interposer and supplies current to the die.
Claims20
A method of fabricating an electronic package, the method comprising:
- securing a die to an interposer;
- securing a laminated conductor to the interposer to supply current to the die and mechanically support the interposer.
An electronic package comprising:
- an interposer;
- a die secured to the interposer;
- and
- a laminated conductor secured to the interposer to mechanically support the interposer and supply current to the die.
1 more element
A computer system comprising:
- a bus;
- a memory coupled to the bus;
- a processor;
- and
- a package including an interposer and a laminated conductor secured to the interposer, the processor being secured to the interposer such that the laminated conductor electrically connects the processor to the bus and mechanically supports the interposer during operation of the computer system.
2 more elements
Dependencies are inferred from the claim text.