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US 2003/0111713 A1Published application
Manufacturing method of tape carrier package and the system thereof
OwnerMing-Hsiang Chenginventor
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Abstract
The invention discloses a manufacturing method of tape carrier package (TCP) and the system thereof, which uses an insulating resin material to attain the object of circuit protection. The resin material will be hardened after irradiating with specific light. By utilizing such characteristics of the chemical reaction, the duration necessary for curing process can be reduced greatly and the process flow in the conventional technology can be simplified.
Claims5
A manufacturing method of a tape carrier package, comprising the steps of:
- welding bumps on a chip and inner leads of said tape carrier by thermo-compression;
- covering said welded region with a UV resin;
- irradiating said UV resin with UV rays for hardening said UV resin;
- and
- rolling said tape carrier on a reel.
2 more elements
A tape carrier package system, including:
- a material-feeding mechanism;
- a resin-dispensing equipment;
- a curing equipment;
- and
- a material-collecting mechanism;
- characterized in that said resin-dispensing equipment utilizes a UV resin and said curing equipment hardens said UV resin by an irradiation of UV rays.
3 more elements
Dependencies are inferred from the claim text.