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US 2003/0111648 A1Published application
Conductive composition exhibiting PTC behavior
OwnerEdward Fu-Hua Chu, David Shau-Chew Wang +1inventors
InventorsEdward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
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Abstract
The present invention discloses a conductive composition, comprising: (a) at least one polymer; (b) at least one conductive filler, dispersed in the polymer; and (c) a coupling agent, applied to improved the adhesion between the polymer and the conductive filler and having a structure as follows: 1 wherein M represents a metal atom or silicon; R1 and R2 represent a substituted or unsubstituted alkyl group; X represents sulfur or phosphorous; and a, m and n represent integers of 0 to 2.
Claims9
A conductive composition exhibiting PTC behavior, comprising:
- (a) at least one polymer;
- (b) at least one conductive filler dispersed in the polymer;
- and
- (c) a coupling agent having a structure as follows:
- 4
- wherein M represents a metal atom or a silicon;
- R1 and R2 represent a substituted or unsubstituted alkyl group;
- X represents a sulfur or a phosphorous;
- a, m and n represent integers of 0 to 2.
6 more elements
Dependencies are inferred from the claim text.