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US 2003/0111519 A1Published application
Fluxing compositions
Assignee3M Innovative Properties Company
InventorsRobert J. Kinney, Michael A. Kropp, Scott B. Charles
Life of this patent
Estimating the term…
Abstract
The present invention provides for a chelate fluxing agent, its use in fluxing compositions, and its use in soldering methods. The fluxing agents as described herein, when combined with a resin such as thermosetting resins, thermoplastic resins or a combination thereof, afford compositions suitable for use as underfill adhesives. The present invention also provides for an electrical component assembly and methods for producing an electrical component assembly including such underfill adhesive compositions.
Claims29
A composition suitable for use as an underfill adhesive comprising
- a thermosetting resin;
- and
- a fluxing agent selected from compounds of the formulae:
- 28
- wherein
- Q is arylene, alkylene, alkenylene, cycloalkylene, cycloalkenylene, heterocyclylene or heteroarylene;
- R1, R2, and R5, are independently H or C1-C6 alkyl;
- R3 and R4 are independently alkyl, cycloalkyl, aryl, heteroaryl, heterocyclyl, substituted with at least one group selected from —OH and —SH provided that R3 and R4 are not phenyl monosubstituted at the 3- or 4-position with hydroxyl;
- and
- R6 and R7 are independently alkyl, cycloalkyl, aryl, heteroaryl, or heterocyclyl, wherein at least one of R6 or R7 is substituted with at least one group selected from —OH and —SH;
- and
- wherein said composition is free of anhydride compounds.
9 more elements
A composition comprising a compound selected from the formulae:
- 29
- wherein
- Q is arylene, alkylene, alkenylene, cycloalkylene, cycloalkenylene, heterocyclylene or heteroarylene;
- R1, R2, and R5, are independently H or C1-C6 alkyl;
- R3 and R4 are independently alkyl, cycloalkyl, aryl, heteroaryl, heterocyclyl, substituted with at least one group selected from —OH and —SH provided that R3 and R4 are not phenyl monosubstituted at the 3- or 4-position with hydroxyl;
- and
- R6 and R7 are independently alkyl, cycloalkyl, aryl, heteroaryl, or heterocyclyl, wherein at least one of R6 or R7 is substituted with at least one group selected from —OH and —SH;
- and
- wherein said composition is a film.
6 more elements
A composition comprising a compound selected from the formulae:
- 30
- wherein
- Q is arylene, alkylene, alkenylene, cycloalkylene, cycloalkenylene, heterocyclylene or heteroarylene;
- R1, R2, and R5, are independently H or C1-C6 alkyl;
- R3 and R4 are independently alkyl, cycloalkyl, aryl, heteroaryl, or heterocyclyl, substituted with at least one group selected from —OH and —SH, provided that R3 and R4 are not phenyl monosubstituted at the 3- or 4-position with hydroxyl;
- and
- R6 and R7 are independently alkyl, cycloalkyl, aryl, heteroaryl, or heterocyclyl, wherein at least one of R6 or R7 is substituted with at least one group selected from —OH and —SH;
- and
- wherein said composition promotes metallurgical wetting and reflow of said metals.
6 more elements
A method of soldering comprising the steps of:
- a) applying a flux composition to a soldering portion of a work, the flux composition comprising a compound selected from the formulae:
- 31
- wherein
- Q is arylene, alkylene, alkenylene, cycloalkylene, cycloalkenylene, heterocyclylene or heteroarylene;
- R1, R2, and R5, are independently H or C1-C6 alkyl;
- R3 and R4, are independently alkyl, cycloalkyl, aryl, heteroaryl, or heterocyclyl, substituted with at least one group selected from —OH and —SH;
- and
- R6 and R7 are independently alkyl, cycloalkyl, aryl, heteroaryl, or heterocyclyl, wherein at least one of R6 or R7 is substituted with at least one group selected from —OH and —SH;
- and
- b) heating said soldering portion to soldering reflow temperatures.
7 more elements
An electrical component assembly comprising:
- an electrical component having a plurality of electrical terminations, each termination including a solder bump;
- a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component;
- and
- an adhesive composition disposed between and bonding the electrical component and the substrate together, the solder bumps being reflowed and electrically connecting the electrical component to the substrate, the adhesive composition comprising the reaction product of:
- a thermosetting resin;
- and
- a fluxing agent selected from compounds of the formulae:
- 32
- wherein
- Q is arylene, alkylene, alkenylene, cycloalkylene, cycloalkenylene, heterocyclylene or heteroarylene;
- R1, R2, and R5, are independently H or C1-C6 alkyl;
- R3 and R4, are independently alkyl, cycloalkyl, aryl, heteroaryl, or heterocyclyl, substituted with at least one group selected from —OH and —SH;
- and
- R6 and R7 are independently alkyl, cycloalkyl, aryl, heteroaryl, or heterocyclyl, wherein at least one of R6 or R7 is substituted with at least one group selected from —OH and —SH.
11 more elements
A method of bonding an electrical component assembly comprising the steps of:
- providing an electrical component having a plurality of electrical terminations, each termination including a solder bump;
- providing a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component;
- providing a sufficient amount of an adhesive composition onto the substrate or electrical component;
- contacting the electrical component or substrate with the composition;
- and
- curing the composition;
- wherein said composition comprises:
- a thermosetting resin;
- and
- a fluxing agent selected from compounds of the formulae
- 33
- wherein
- Q is arylene, alkylene, alkenylene, cycloalkylene, cycloalkenylene, heterocyclylene or heteroarylene;
- R1, R2, and R5, are independently H or C1-C6 alkyl;
- R3 and R4, are independently alkyl, cycloalkyl, aryl, heteroaryl, or heterocyclyl, substituted with at least one group selected from —OH or —SH;
- and
- R6 and R7 are independently alkyl, cycloalkyl, aryl, heteroaryl, or heterocyclyl, wherein at least one of R6 or R7 is substituted with at least one group selected from —OH and —SH.
14 more elements
Dependencies are inferred from the claim text.