Method and apparatus for repair of defects in materials with short laser pulses

A method of laser ablation from an component comprising the steps of:

• providing an component;
• providing a low energy alignment beam projector for directing a low energy beam of light;
• providing a laser for delivering light pulses for which the width is sufficiently short and the intensity sufficiently high to removing material around a focal region while minimizing peripheral damage;
• aligning the low energy beam of light and the light pulses;
• determining locations on the component for ablation of material therefrom;
• aligning the low energy beam of light toward the determined locations;
• while maintaining alignment of the low energy beam of light, firing the laser to ablate material from a determined location from the determined locations.

A system for ablating material from an electronic or opto-electronic component comprising:

• a detection system for locating a location from which to ablate material;
• a high energy laser for delivering light pulses the width of which is sufficiently short and the intensity sufficiently high to provide minimal substantial peripheral damage during material removal;
• a low energy alignment light source;
• a first optical path for receiving light from the laser and directing the light toward a focal point;
• a second optical path for receiving light from the low energy alignment light source and directing the light toward the focal point;
• a system for controlling a pattern of the laser in the vicinity of a component.