Electroplating solution for copper thin film
OwnerTohru Hara, Shoichi Ishida +2inventors
InventorsTohru Hara, Shoichi Ishida, Mitsuo Miyamoto, Tetsuo Yonezawa
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Abstract
A plating solution containing 10 to 40 wt % of copper hexafluorosilicate. With the use of this plating solution, a copper thin film which has a low film stress and a low resistivity and which strongly (111)-oriented is plating-deposited on the fine pattern portion a copper seed layer, and film peeling caused by deterioration of an adhesion force between an underlying barrier layer and a copper seed layer even in a heat treatment process and in a chemical mechanical polishing (CMP) process after plating deposition is prevented.
Claims5
An electroplating solution for a copper thin film wherein said solution contains 10 to 40 wt % of copper hexafluorosilicate and is used as an electrolyte in plating in which a copper thin film is selectively plating-deposited on a copper seed layer.
Dependencies are inferred from the claim text.