Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device
AssigneeFujitsu Limited
InventorsShunichi Kikuchi, Mitsutaka Yamada, Kenji Iketaki
Life of this patent
Estimating the term…
Abstract
A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.
Claims15
A printed wiring board device comprising:
- circuit parts mounted on a wiring board and constituting parts of a circuit in the printed wiring board device;
- pads provided on the wiring board in the circumference of the circuit parts and being electrically isolated from the circuit;
- and
- heat-absorbing dummy parts mounted on the pads and absorbing heat from the circuit parts through the pads during reflow soldering.
A printed wiring board device comprising:
- circuit parts mounted on a wiring board at positions isolated from other parts on the wiring board, the circuit parts constituting parts of a circuit in the printed wiring board device;
- and
- heat-absorbing dummy parts mounted on the wiring board by using an adhesive agent that is thermally conductive, the dummy parts absorbing heat from the circuit parts through the adhesive agent during reflow soldering.
A method of manufacture of a printed wiring board device having circuit parts mounted on a wiring board and constituting parts of a circuit in the printed wiring board device, the method comprising steps of:
- providing pads on the wiring board in the circumference of the circuit parts such that the pads are electrically isolated from the circuit;
- applying a solder to the wiring board in accordance with a wiring pattern of the wiring board;
- mounting heat-absorbing dummy parts on the pads;
- and
- performing a reflow soldering of the printed wiring board device to produce solder junctions on the wiring board by using a reflow equipment, wherein the dummy parts absorbs heat from the circuit parts through the pads during the reflow soldering, thereby preventing an excessive temperature rise of the circuit parts.
An information processing apparatus in which a printed wiring board device is provided, the printed wiring board device comprising:
- circuit parts mounted on a wiring board and constituting parts of a circuit in the printed wiring board device;
- pads provided on the wiring board in the circumference of the circuit parts and being electrically isolated from the circuit;
- and
- heat-absorbing dummy parts mounted on the pads and absorbing heat from the circuit parts through the pads during reflow soldering.
Dependencies are inferred from the claim text.