Back to results
US 2003/0111213 A1Published application
Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
AssigneeIntel Corporation
InventorsJe Young Chang, Eric DiStefano
Life of this patent
Estimating the term…
Abstract
An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be formed of a thermally conductive material, and a width of the heat absorber is greater than a width of the base.
Claims18
An apparatus, comprising:
- a heat absorber attached to a first end of a base, the heat absorber and the base formed of a thermally conductive material, wherein a width of the heat absorber is greater than a width of the base.
An apparatus, comprising:
- a base formed of a heat conductive material, the base having a first end and a second end;
- a heat absorber attached to the first end of the base, the heat absorber having a first width greater than a second width of the base, the heat absorber having a top surface and a planar bottom surface, the planar bottom surface having a first surface area approximately equal to a second surface area of an integrated heat spreader attached to a silicon die;
- and
- a heat dissipator attached to the second end of the base.
1 more element
A computer system, comprising:
- a processor mounted to a printed circuit board;
- a bus coupled with the processor;
- a memory coupled with the bus;
- and
- a heat absorber formed of a thermally conductive material and coupled with the processor, the heat absorber attached to a first end of a base formed of the thermally conductive material, wherein a width of the heat absorber is greater than a width of the base.
2 more elements
Dependencies are inferred from the claim text.