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US 2003/0111179 A1Published application
Etcher for semiconductor manufacturing
AssigneeWinbond Electronics Corp.
InventorsMon-Long Fang, Sung-Hui Huang, Jeng-Yin Lin, Ting-Wang Chou, Chi-How Hsu
Life of this patent
Estimating the term…
Abstract
The present invention provides an etcher for semiconductor manufacturing. The etcher comprises a chamber for accepting a wafer, having an inlet and outlet through which a gas is pumped into and out of the chamber, first and second electrodes generating an electrical field to ionize the gas for reacting with the wafer, and a plate disposed between the inlet and outlet, deflecting the gas flow therebetween.
Claims10
An etcher for semiconductor manufacturing comprising:
- a chamber for accepting a wafer, having an inlet and outlet through which a gas is pumped into and out of the chamber respectively;
- a first and second electrodes generating an electrical field to ionize the gas for reacting with the wafer;
- and
- a plate disposed between the inlet and outlet, deflecting the gas flow therebetween.
1 more element
An etcher for semiconductor manufacturing comprising:
- a chamber for accepting a wafer, having an inlet and outlet through which a gas is pumped into and out of the chamber respectively;
- a first and second electrodes generating an electrical field to ionize the gas for reacting with the wafer;
- and
- a plate disposed between the inlet and outlet, deflecting the gas flow therebetween, and having a plurality of holes through which the reacted gas flows to the outlet.
1 more element
Dependencies are inferred from the claim text.