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US 2003/0111176 A1Published application
Apparatus for polishing semiconductor wafer
OwnerJae-Won Choi, Hyeung-Yeul Kiminventors
Life of this patent
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Abstract
A wafer planarizing apparatus includes a cleaner that prevents contamination caused by a fume phenomenon occurring when slurry is cleaned from a base of a polishing station. The cleaner has spout holes through which a cleaning solution is applied to a side of a platen of the polishing station. As the cleaning solution flows along the side of the platen, the side of the platen is cleaned. Beneficially, a main body of the cleaner has an arch-shaped upper side so as to stream down foreign materials.
Claims19
A wafer planarizing apparatus comprising:
- a polishing station with a base on which a platen having a polishing pad is placed;
- a polishing head for polishing a wafer on the polishing pad of the platen;
- and
- a cleaner disposed upon the base of the polishing station,
- wherein the cleaner has a main body and a first cleaning unit installed in the main body, the first cleaning unit being adapted to clean a side of the platen.
2 more elements
A wafer planarizing apparatus, comprising:
- a polishing station, comprising,
- a base,
- a platen mounted on the base, the platen having a polishing means thereon;
- and
- a polishing head adapted to polish a wafer on the polishing means;
- and
- a cleaner disposed on the base of the polishing station, the cleaner having a first cleaning unit adapted to apply a cleaning solution to clean a side of the platen.
4 more elements
Dependencies are inferred from the claim text.