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US 2003/0111154 A1Published application
Automated method of attaching flip chip devices to a substrate
AssigneeMicron Technology, Inc.
InventorsRich Fogal, John VanNortwick, Chad A. Cobbley
Life of this patent
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Abstract
Apparatus and method for attaching, assembling, and/or mounting a substrate to any semiconductor device or a flip-chip type semiconductor device.
Claims12
A semiconductor device mounting method comprising:
- providing a semiconductor device located on a table;
- providing a substrate having an aperture therethrough and having an adhesive thereon;
- and
- mounting the substrate over the semiconductor device, the substrate attached to the semiconductor device by the adhesive located thereon.
1 more element
A semiconductor device mounting method comprising:
- determining the inclination of a semiconductor device set on a setting table at a mounting position;
- changing an inclination of said setting table in accordance with said inclination of said semiconductor device;
- positioning a substrate at said mounting position of said semiconductor device;
- and
- mounting said substrate on said semiconductor device.
2 more elements
A method for mounting a substrate having at least one circuit on one side thereof to a semiconductor device comprising:
- attaching at least one piece of adhesively coated tape to said substrate;
- placing said substrate over said semiconductor device;
- and
- attaching the substrate to the semiconductor device using the at least one piece of adhesively coated tape attached to the substrate.
1 more element
A substrate mounting method for a semiconductor device comprising:
- placing said semiconductor device on a movable apparatus in a desired mounting position;
- placing a substrate on a movable apparatus;
- positioning said substrate at said mounting position of said semiconductor device;
- and
- attaching said substrate to said semiconductor device having said substrate located thereabove.
2 more elements
Dependencies are inferred from the claim text.