Method of processing substrates using pressurized mist generation

A method for processing substrates comprising:

• placing at least one wafer having an edge in a process tank having a lid, the wafer being in a substantially upright position;
• filling the process tank with ozonated deionized water to a predetermined level below the edge of the wafer;
• closing the lid;
• filling the remaining volume of the process tank with ozone, the ozone being under pressure;
• applying megasonic energy to the ozonated deionized water so as to form a mist of the ozonated deionized water in the process tank, the megasonic energy passing through the ozonated deionized water and across the wafer;
• spraying the ozonated deionized water over the wafer surface;
• and

A process tank having a processing chamber comprising:

• means to support at least one wafer in the processing chamber;
• means for filling the chamber with a process liquid;
• a lid adapted to close the chamber;
• a liquid level sensor adapted to stop the supply of process liquid to the chamber when the process liquid fills the chamber to a predetermined level below a wafer supported in the processing chamber;
• and
• an acoustical energy source adapted to supply acoustical energy to process liquid located in the chamber so as to create a mist of the process liquid in the processing chamber.