Back to results
US 2003/0110887 A1Published application
Densified sintered powder and method
AssigneeHoneywell International Inc.
InventorsKenneth J. Bartone, Santosh K. Das
Life of this patent
Estimating the term…
Abstract
A powder for metal injection molding of has a silicon content of less than 0.1%. Silica inclusions are substantially eliminated in the finished molded product.
Claims8
A power for metal injection molding, the improvement comprising the powder having a silicon content of not more than 0.1%.
An injection molding feedstock powder, comprising:
- a metal powder having a silicon content of not more than 0.1%, and
- a binder.
A molded metal part, comprising the improvement of:
- the molded metal part being formed by metal injection molding from a powder having a silicon content of not more than 0.1%.
Dependencies are inferred from the claim text.