Method and apparatus for cooling an integrated circuit package using a cooling fluid
AssigneeIntel Corporation
InventorsPaul B. Koeneman, Mark A. Trautman
Life of this patent
Estimating the term…
Abstract
A method and apparatus for cooling an integrated circuit die. An integrated circuit package comprises an integrated circuit die. A cooling fluid makes contact with the integrated circuit die. In one embodiment, an interposer is disposed between the integrated circuit die and a package substrate. The integrated circuit die and/or the interposer may have microchannels in its surface.
Claims29
An integrated circuit package comprising:
- an integrated circuit die having an active surface;
- and
- a cooling fluid in contact with the active surface.
A method of forming an integrated circuit package comprising:
- attaching an interposer to a package substrate;
- attaching an integrated circuit die to the interposer;
- covering the package substrate, the integrated circuit die, and the interposer with a heat spreader to form an internal chamber;
- filling the internal chamber with a cooling fluid.
A method of cooling an integrated circuit die within an integrated circuit package comprising:
- providing power to the integrated circuit die;
- and
- moving a cooling fluid across an active surface of the integrated circuit die.
An integrated circuit package comprising:
- a package substrate;
- a first integrated circuit die having an active surface;
- an interposer disposed between the package substrate and the first integrated circuit die, the interposer establishing electrical connectivity between the first integrated circuit die and the package substrate;
- and
- a cooling fluid disposed between the first integrated circuit die and the interposer.
An integrated circuit package comprising:
- a integrated circuit die housed within a chamber;
- a cooling fluid filling the chamber and in contact with the integrated circuit die.
Dependencies are inferred from the claim text.