Apparatus and method for augmented cooling of computers
OwnerRobert W. Otey, Brian D. Rabeinventors
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Abstract
A combination of a computer and an external heat transfer module to improve the heat removing capability of a computer's internal heat removal system, the combination includes a computer with a thermal interface port connected to the computer's internal heat removal system and a heat transfer module connected to the thermal interface port. The heat transfer module has a heat dissipation component and at least one heat transfer conduit having one end thermally coupled to the computer's internal heat removal system, and the other end thermally coupled to the heat dissipation component.
Claims29
An external heat transfer module to improve the heat removing capability of a computer's internal heat removal system, said module comprising:
- a thermoelectric device;
- a heat conductive plate in thermal contact with a cool side of said thermoelectric device;
- and
- at least one heat transfer conduit having a first portion adjacent to one end of said at least one heat transfer conduit and thermally coupled to said computer's internal heat removal system, and a second portion adjacent the other end of said at least one heat transfer conduit, said second portion thermally coupled to said heat conductive plate.
An external heat transfer module for improving the heat removing capability of a computer's internal heat removal system, said module comprising:
- thermoelectric means having a hot side and a cold side;
- and
- heat transfer means thermally coupled to said cold side of said thermoelectric means for transferring heat from said computer's heat removal system to said thermoelectric means.
In combination a computer and an external heat transfer module, said combination comprising:
- a computer with a thermal interface port connected to the computer's internal heat removal system;
- and
- a heat transfer module external to said computer, said heat transfer module connected to said thermal interface port of said computer.
A docking station for a laptop computer comprising:
- an enclosure;
- a laptop computer interface on at least one side of said enclosure wherein said interface has at least a thermal interface port;
- and
- a heat transfer module within said enclosure and coupled to said thermal interface port, said heat transfer module comprising:
- a heat dissipating device;
- and
- at least one heat transfer conduit having a first portion adjacent one end of said at least one heat transfer conduit thermally connected to said heat dissipating device, and a second portion adjacent the other end of said at least one heat transfer conduit, said second portion being thermally connected to said thermal interface port.
A method of making an external device for improving the heat removing capability of a computer's internal heat management system, said method comprising:
- attaching a first portion of one end of a heat transfer conduit to a heat dissipating device;
- and
- configuring a second portion of the other end of said heat transfer conduit for thermally mating with a heat dissipation end of said computer's internal heat management system.
A method of improving the heat removing capability of a computers internal heat removal system, said method comprising:
- obtaining a heat transfer module having one end of a heat transfer conduit thermally coupled to said heat transfer module and the other end of said heat transfer conduit configured for mating to a thermal interface port of a computer, said thermal interface port thermally coupled to said computer's internal heat removal system;
- thermally connecting said other end of said heat transfer conduit to said thermal interface port;
- and
- enabling said heat transfer module.
Dependencies are inferred from the claim text.