US 2003/0110629 A1Published application

Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package

AssigneeChung-Shan Institute of Science and Technology

InventorsGwo-Ji Horng, Jen-I Kuo, Feng-Ger Hsiau

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Abstract

A method of fabricating a thermal conductive plug of a ceramic substrate of a multi-chip package. A plurality of conductive openings and thermal conductive openings are formed on green tapes. A metal paste is filled into the conductive openings and the thermal conductive openings. The green tapes are stacked together so that the metal paste inside the conductive openings and the thermal conductive openings of every green tape is in contact respectively with its neighboring metal paste within the conductive openings and thermal conductive openings of the green tapes. Cofire those green tapes and the metal paste to form a pre-substrate. The pre-substrate comprises an insulating structure, a plurality of thermal conductive plugs and conductive plugs.

Claims49

Dependent claims

A method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package, wherein the method comprises:

providing a plurality of green tapes;
forming a plurality of conductive openings and thermal conductive openings on the green tapes;
filling a metal paste into the conductive openings and the thermal conductive openings;
stacking the green tapes together, wherein the metal paste inside the conductive openings of every green tape is in contact with its neighboring metal paste within the conductive openings of the green tapes, the metal paste inside the thermal conductive openings of each green tape is in contact with each neighboring metal paste inside the thermal conductive openings;
cofirng those green tapes and the metal paste to form a pre-substrate, wherein the pre-substrate comprises an insulating structure, a plurality of thermal conductive plugs and conductive plugs, the insulating structure is formed by cofiring the green tapes so that a plurality of conductive plugs are formed due to the cofiring on the metal paste in the conductive openings and a plurality of thermal conductive plugs are also formed by cofiring the metal paste inside the thermal conductive openings, the pre-substrate further comprises a top surface and a bottom surface;
forming a first metal film on the top surface of the pre-substrate;
forming a second metal film on the bottom surface of the pre-substrate;
patterning the first metal film to form a plurality of die pads and conductive traces, the die pads in contacted with the thermal conductive plugs and the conductive traces in contacted with the conductive plugs;
adhering a plurality of chips on the die pads;
and
electrically connecting the chips to the conductive traces.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/034,030Filed 19 Dec 2001
Published: 19 Jun 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification28 codes

H05K 1/0206
Using means for thermal conduction connection in the thickness direction of the substrate: by printed thermal vias
H05K 3/4629
Characterised by the insulating layers or materials: laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
H05K 3/4679
By building the multilayer layer by layer, i.e. build-up multilayer circuits: aligning added circuit layers or via connections relative to…
H10W 40/228
Characterised by projecting parts, e.g. fins to increase surface area: the projecting parts being wire-shaped or pin-shaped