Method for connection of circuit units
AssigneeInfineon Technologies AG
InventorsGerd Frankowsky, Harry Hedler, Roland Irsigler, Thorsten Meyer, Barbara Vasquez
Life of this patent
Estimating the term…
Abstract
The invention creates a method for connection of circuit units (101a-10n) which are arranged on a wafer (100), in which the wafer (100) is fitted to a first film (102a), the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated, the functional circuit units (101d) are picked up by means of a handling device (101) and are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units (101d).
Claims11
A method for connection of circuit units (101a-101n), which are arranged on a wafer (100) having the following steps:
- a) the wafer (100) is fitted to a first film (102a);
- b) the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated;
- c) functional circuit units (101d) are picked up by means of a handling device (103);
- and
- d) the functional circuit units (101d) which have been picked up are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined.
The method as claimed in one or more of the preceding claims, wherein
- a modified wafer (101a) is created, in which the distance between individual adjacent functional circuit units (101d) is greater.
The method as claimed in one or more of the preceding claims, wherein
- a lateral dimension change is produced in the modified wafer (100a) by incorporating at least one cutout (104).
The method as claimed in one or more of the preceding claims, wherein
- the functional circuit units (101d) which are arranged on the modified wafer (100a) are packaged using an encapsulation compound (105).
The method as claimed in one or more of the preceding claims, wherein
- connection units (106) are fitted to those surfaces of the functional circuit units (101d) which are not covered with the encapsulation compound (105).
The method as claimed in one or more of the preceding claims, wherein
- connection contacts (107) for connection of the functional circuit units (101d) are arranged on the connection units (106).
The method as claimed in one or more of the preceding claims, wherein
- the functional circuit units (101d) which are arranged on the modified wafer (100a) are separated by sawing the modified wafer (100a).
The method as claimed in one or more of the preceding claims, wherein
- the connection contacts (107) which are arranged on the connection unit (106) are produced outside the silicon surface of the functional circuit unit (101d).
Dependencies are inferred from the claim text.