Substrate for receiving a circuit configuration and method for producing the substrate
AssigneeEUPEC Europaeische Gesellschaft fuer Leistungshalbleiter mbH & Co. KG
InventorsGottfried Ferber, Reimund Pelmer
Life of this patent
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Abstract
A substrate is adapted to accommodate a circuit configuration. The novel substrate is stable under alternating loads and it favorably dissipates heat. To this end, the substrate has a fastening zone to be connected to a contact element that is to be provided. The fastening zone is fixed on the carrier substrate with a first section. A second section projects from the plane of the carrier substrate, and the first and the second sections are adapted to be electrically and mechanically connected to the contact element.
Claims19
A substrate for receiving a circuit configuration of electronic components, comprising:
- a substantially planar carrier substrate defining a plane and having a surface;
- a contact substrate formed at least partly of surface regions disposed on said surface of said carrier substrate and adapted to be connected to electronic components of the circuit configuration;
- said contact substrate including a contiguous contact substrate region;
- said contact substrate region having a first part forming a surface region disposed on and mechanically connected to said carrier substrate;
- said contact substrate region having a second part projecting out of said plane of said carrier substrate;
- and
- said first part and said second part of said contact substrate region forming at least a part of a fixing region adapted to receive a contact element for conducting electrical current and for electrically and mechanically connecting to the contact element.
Dependencies are inferred from the claim text.