Solder resist opening to define a combination pin one indicator and fiducial
AssigneeMicron Technology, Inc.
InventorsBrad D. Rumsey, Matt E. Schwab
Life of this patent
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Abstract
The present invention features a novel design for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial of the present invention are also provided.
Claims36
A method of fabricating a carrier substrate for mounting at least one semiconductor device, comprising:
- providing a substrate having a first surface and a second surface;
- providing at least one semiconductor device attach site on at least one of the first surface and the second surface;
- forming a plurality of conductors on at least one of the first surface and the second surface;
- disposing a solder mask layer on at least part of the at least one of the first surface and the second surface;
- and
- providing an opening in the solder mask layer serving as a combination pin one indicator and alignment fiducial for both aligning a semiconductor device during a die attach process and for aligning a severing device for singulating the substrate.
A method of fabricating a carrier substrate having a first surface and a second surface for mounting at least one semiconductor device, comprising:
- forming at least one semiconductor device attach site on at least one of the first surface and the second surface;
- forming a plurality of conductors on at least one of the first surface and the second surface;
- disposing a solder mask layer on at least part of the at least one of the first surface and the second surface;
- and
- providing an opening in the solder mask layer serving as a combination pin one indicator and alignment fiducial for both aligning a semiconductor device during a die attach process and for aligning a severing device for singulating the substrate.
Dependencies are inferred from the claim text.