Semiconductor device and method for producing the same, and anisotropic conductive circuit board

A method for producing a semiconductor device comprising the steps of:

• (a) bundling and arranging a plurality of conductive members, each of which includes fine line-like conductive materials whose outer circumference is covered with an insulating material to form a conductive member cluster;
• (b) attaching and fixing the conductive members constituting the conductive member cluster to each other with an insulative resin to form a rectangular solid substrate block;
• (c) slicing the substrate block with a predetermined thickness to form a substrate element in which cross-sections of the plurality of conductive materials and the insulating materials covering the outer circumferences of the corresponding conductive materials are arranged and whose periphery is made of the insulating resin and the plurality of conductive members;
• (d) forming metal coating films on an upper surface and a lower surface of the substrate element, thereby forming a circuit board;
• (e) mounting a semiconductor element having an electrode terminal on an upper surface of the circuit board;
• (f) electrically connecting the electrode terminal of the semiconductor element mounted on the circuit board and the conductive material positioned on the upper substrate of the circuit board with a connecting member;
• and
• (g) sealing a periphery of the semiconductor element mounted on the upper surface of the circuit board and the connecting member with a sealing resin.