US 2003/0080418 A1 · SEMICONDUCTOR DEVICE HAVING POWER SUPPLY PADS ARRANGED BETWEEN SIGNAL PADS AND SUBSTRATE EDGE

Abstract

General-purpose properties are imparted to a base substrate mounting a semiconductor chip thereon so that one type of base substrate is responsible for a design change of a semiconductor chip or mounting of different types of semiconductor chips. A semiconductor chip-mounting region is provided on one surface of an insulating sheet-shaped substrate, external terminals for signal and external terminals for power supply are provided on the other surface. With respect to the external terminals for signal or power supply, which are, respectively, connected at one end thereof with external electrodes of the semiconductor chip mounted on the one surface and at the other end with the external terminals on the other surface, end portions of the signal wirings are provided around the semiconductor chip-mounting region on the one surface and end portions of the power supply wirings are provided outwardly of the end portions of the signal wirings. The wirings for power supply are provided outward of the signal wirings, so that even if external electrodes for power supply of a semiconductor chip are arranged at any positions, they can be readily connected with power supply wirings by means of a bonding wire.

Claims14

Dependent claims

A semiconductor device of the type in which a semiconductor chip is mounted on one surface of a base substrate, an external terminal is formed on the other surface, and a wiring provided on the base substrate is connected at one end thereof with an external electrode of the semiconductor chip on the other surface and at the other end thereof with the external terminal on the other surface, wherein said external terminal includes external terminals for signal and external terminals for power supply, end portions of wirings for signal connected with the external terminals for signal are provided around said semiconductor chip on the one surface and end portions of wirings for power supply connected with the external terminals for power supply are provided outwardly of the end portions of the wirings for signal.

A semiconductor device of the type which comprises:

a wiring substrate including a first surface and a second surface opposite to said first surface, a power supply wiring and a plurality of signal wirings formed on said first surface, and a plurality of external terminals formed on said second surface wherein said power supply wiring and said signal wirings are, respectively, electrically connected with said plurality of external terminals through a plurality of through-hole wirings;
a semiconductor chip having an integrated circuit on its main surface and a plurality of bonding pads formed thereon and arranged on said first surface of said wiring substrate;
first wires electrically connecting said plurality of signal wirings and corresponding bonding pads therewith;
a plurality of second wires electrically connecting said power supply wirings and corresponding bonding pads;
and
a resin body formed on said first surface for sealing said semiconductor chip, said power supply wiring, said plurality of signal wiring, and said first wires and the second wires therewith, wherein said plurality of signal wires, respectively, have a first portion provided between said semiconductor chip and a first main surface of said wiring substrate, and a second portion integrally formed with said first portion and located outwardly of said semiconductor chip, said first wires are connected with said second portions of said signal wirings, and said power supply wirings are positioned outwardly of said second portions of said signal wirings.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor device having power supply pads arranged between signal pads and substrate edge

Life of this patent

Semiconductor device having power supply pads arranged between signal pads and substrate edge

Life of this patent

Abstract

Claims14