Bumpless wafer scale device and board assembly
AssigneeTexas Instruments Incorporated
InventorsEdgar R. Zuniga-Ortiz, Sreenivasan K. Koduri
Life of this patent
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Abstract
A semiconductor chip having a planar active surface including an integrated circuit; the circuit has metallization patterns including a plurality of contact pads. Each of these contact pads has an added conductive layer on the circuit metallization. This added layer has a conformal surface adjacent the chip and a planar outer surface, and this outer surface is suitable to form metallurgical bonds without melting. The chip contact pads may have a distribution such that an area portion of the active chip surface is available for attaching a thermally conductive plate; this plate has a thickness compatible with the thickness of the conductive pad layer.
Claims32
A semiconductor device comprising:
- a semiconductor chip having a planar active surface including an integrated circuit, said circuit having metallization patterns including a plurality of contact pads;
- each of said contact pads having an added conductive layer on said metallization, said added layer having a conformal surface adjacent said chip and a planar outer surface, said outer surface suitable to form metallurgical bonds without melting.
A semiconductor assembly comprising:
- a semiconductor chip having a planar active surface including an integrated circuit, said circuit having metallization patterns including a plurality of contact pads, each of said contact pads having an added conductive layer on said metallization, said added layer having a conformal surface adjacent said chip and a planar outer surface, said outer surface suitable to form metallurgical bonds without melting;
- and
- an assembly board having a plurality of planar, metallurgically bondable terminal pads in a distribution aligned with the distribution of said chip contact pads;
- said chip metallurgically bonded to said board so that each of said chip contact pads is connected to a corresponding board terminal pad.
A semiconductor assembly comprising:
- a semiconductor chip having a planar active surface including an integrated circuit, said circuit having metallization patterns including a plurality of contact pads, said contact pads distributed such that an area portion of said chip surface is available for attaching a thermally conductive plate;
- each of said contact pads having an added conductive layer on said metallization, said added layer having a conformal surface adjacent said chip and a planar outer surface, said outer surface suitable to form metallurgical bonds without melting;
- said thermally conductive plate, attached to said active chip surface, having a thickness compatible with the thickness of said chip contact layers, and a surface suitable for metallurgical bonds;
- and
- an assembly board having a plurality of planar, metallurgically bondable terminal pads in a distribution aligned with the distribution of said chip contact pads, and further having a thermally conductive site with a metallurgically bondable surface in a location aligned with the location of said chip plate;
- said chip metallurgically bonded to said board so that each of said chip contact pads is connected to the corresponding board terminal pad, and said said plate is connected to said corresponding thermally conductive site.
A method for fabricating a semiconductor device having a semiconductor chip including a planar active surface and a metallization pattern including a plurality of contact pads, comprising the step of:
- depositing at least one added conductive layer on said metallization of said contact pads, said added layer having a conformal surface adjacent said chip and a planar outer surface, said outer surface suitable to form metallurgical bonds without melting.
A method for fabricating a semiconductor assembly comprising the steps of:
- providing a semiconductor chip having a planar active surface including an integrated circuit, said circuit having metallization patterns including a plurality of contact pads, each of said contact pads having an added conductive layer on said metallization, said added layer having a conformal surface adjacent said chip and a planar outer surface, said outer surface suitable to form metallurgical bonds without melting;
- providing an assembly board having a plurality of planar, metallurgically bondable terminal pads in a distribution aligned with the distribution of said chip contact pads;
- aligning said added chip metallization and said board pads so that each of said chip contact pads is connected to a corresponding board terminal pad;
- and
- metallurgically bonding said chip metallization and said board pads.
Dependencies are inferred from the claim text.