Semiconductor device and an electronic device

A semiconductor device, comprising:

• a package substrate having a semiconductor chip mounted on a surface thereof and a plurality of wiring layers provided with external terminals on a back surface thereof,
• wherein said semiconductor chip includes,
• an internal circuit;
• a plurality of output circuits each of which outputs a signal formed by said internal circuit;
• a first voltage supply electrode which supplies an operating voltage to said internal circuit;
• and
• a plurality of second voltage supply electrodes which supply operating voltages to said plurality of output circuits, and
• wherein said package substrate includes,
• a first electrode provided on a substrate surface equipped with said semiconductor chip and having one end connected to said first voltage supply electrode of said semiconductor chip;
• a plurality of second electrodes provided on the substrate surface equipped with said semiconductor chip and having one ends respectively connected to said plurality of second voltage supply electrodes of said semiconductor chip;
• first wiring means which includes a wiring layer different from a wiring layer formed with each of said first and second electrodes and commonly connects said second electrodes respectively;
• second wiring means which connects said first electrode to a corresponding one of said external terminals provided on the back surface;
• and
• a plurality of third wiring means which respectively connect said first wiring means to a plurality of external terminals provided on the back surface, which are equivalent to a number aggregated to a number fewer than said second electrodes.