Configuration of a flat carrier with a chip module in a padded envelope and method of arranging the configuration
AssigneeInfineon Technologies AG
InventorManfred Fries
Life of this patent
Estimating the term…
Abstract
A configuration of a flat carrier with a chip module in a padded envelope, which can be transported in a transport device in the direction of one of the envelope's side edges, includes disposing the chip module in the padded envelope such that wire connections in the chip module extend over a side of the semiconductor chip that runs parallel to the transport device. Such a configuration is made possible by the fact that the flat carrier is applied in a standard way to a further carrier, which is folded in a suitable way.
Claims23
A configuration for transporting a chip module carrier, comprising:
- a padded envelope having side edges to be transported in a transport device along a transport direction corresponding to at least one of said side edges;
- and
- a flat carrier having a chip module with a semiconductor chip and wire connections connected to said semiconductor chip, said flat carrier being disposed in said padded envelope to extend said wire connections over a side of said semiconductor chip running parallel to said transport direction.
In a padded envelope having side edges to be transported in a transport device along a transport direction corresponding to at least one of the side edges, a chip module carrier transporting configuration, comprising:
- a flat carrier having a chip module with a semiconductor chip and wire connections connected to said semiconductor chip, said flat carrier to be disposed in the padded envelope to extend said wire connections over a side of said semiconductor chip running parallel to the transport direction.
A method for configuring a flat carrier with a chip module in a padded envelope, which comprises:
- applying the flat carrier with the chip module to an area of a further carrier;
- folding the further carrier to create a folding line traversing the area occupied by the flat carrier;
- and
- enveloping the further carrier in the padded envelope.
A method for configuring a flat carrier with a chip module in a padded envelope, which comprises:
- folding the further carrier with the chip module at a folding line from an original shape of the further carrier;
- applying the flat carrier to the further carrier to at least partly traverse the folding line with the flat carrier;
- folding the further carrier back at the folding line to place the further carrier in the original shape;
- and
- enveloping the further carrier in the padded envelope.
A method for safely transporting a chip module carrier, which comprises:
- applying a flat carrier having a chip module to an area of a further carrier;
- folding the further carrier to create a folding line traversing the area occupied by the flat carrier;
- and
- enveloping the further carrier in a padded envelope.
A method for safely transporting a chip module carrier, which comprises:
- folding a carrier at a folding line from an original shape of the carrier;
- applying a flat chip module carrier to the carrier to at least partly traverse the folding line with the flat chip module carrier;
- folding the carrier back at the folding line to place the carrier in the original shape;
- and
- enveloping the carrier in a padded envelope.
Dependencies are inferred from the claim text.